Haoruiox CP100

Haoruiox® CP100 is applied to the planarization of STI and ILD layers in mature manufacturing processes above 14nm. Meanwhile, it can be customized according to customer needs. The MRR (Material Removal Rate) and selection ratio can be tailored by adjusting the chemical activity and physical hardness of particles. It is suitable for 14nm-28nm chip manufacturing processes and packaging processes. With uniform particle size, concentrated particle size distribution, good morphology consistency, high cutting rate and low surface defects, it can effectively improve product yield.